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专利名称：Soldering apparatus of a reflow type发明人：Kondo, Kenshi申请号：EP300492.9申请日：190119公开号：EP0325451B1公开日：19940323
摘要：A soldering apparatus (4) of a reflow type contains a preheating chamber (8, 9)and a reflow chamber (10) which are provided with a plurality of heaters (11) for heatingprinted circuit boards (1) with chips (2) temporarily mounted thereon with solder pastes(3) during conveyance by a conveyor (5). The heaters (11) are provided with a screeningmember (26) and/or a partition member (12) so as to prevent direct radiation of radiantheat from the heaters (11) into the chambers and onto the printed circuit boards (1) andto provide a unform air flow so as to be blown uniformly onto the printed circuit boards(1). The heaters (11) are arranged so as to heat them in such a manner as to ascendtemperatures in the order from an inlet (6) to an outlet (7) so as to become higher with apredetermined temperature differential from the previous heater, thus removingbubbles generated upon fusion of the solder pastes (3) and minimizing a heat shockexerted on the chips (2) when they are heated. The soldering apparatus is furtherprovided with a combustion unit (20) with a catalyst (23) for removing fume and odoringgases generated in the chamber and for circulating the heated air after removal of suchfume and gases. These arrangement can provide printed circuit boards of higher qualityand with high productivity.
申请人：NIPPON DENNETSU KEIKI KK
地址：JP
国籍：JP
代理机构：Allam, Peter Clerk
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